Alignment between subsequent 3D molding layers for optimized performance of 3D integrated patch antennas for advanced sensing applications
Nyake Gahein-Sama, Marc Dreissigacker, Friedrich Müller, Christian Tschoban, Tanja Braun, Karl-Friedrich Becker, Martin Schneider-Ramelow
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Poster
13 Sep 2024
This paper addresses packaging-related challenges in 3D compression molding technology, presenting a technological solution for the high precision alignment of pre-molded substrates for a second overmolding step. The work systematically compares four different approaches to increase alignment accuracy, evaluates the technological pros/cons also experimentally and provides experimental proof to the applicability of the high precision alignment solution found.
