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A Back Illuminated 10um SPAD Pixel Array Comprising Full Trench Isolation and Cu Cu Bonding With Over 14% PDE at 940nm

K. Ito, Y. Otake, Y. Kitano, A. Matsumoto, J. Yamamoto, T. Ogasahara, H. Hiyama, R. Naito, K. Takeuchi, T. Tada, K. Takabayashi, H. Nakayama, K. Tatani, T. Hirano, T. Wakano

DOI
10.17023/dh40-rs35
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