Skip to main content

A Back Illuminated 10um SPAD Pixel Array Comprising Full Trench Isolation and Cu Cu Bonding With Over 14% PDE at 940nm

K. Ito, Y. Otake, Y. Kitano, A. Matsumoto, J. Yamamoto, T. Ogasahara, H. Hiyama, R. Naito, K. Takeuchi, T. Tada, K. Takabayashi, H. Nakayama, K. Tatani, T. Hirano, T. Wakano

  • EDS
    Members: $5.00
    IEEE Members: $10.00
    Non-members: $20.00
    Length: 00:19:51

More Like This

GM '24 Panel Session Bundle
25 Sep 2024

GM '24 Panel Session Bundle

  • PES
    Members: Free
    IEEE Members: $675.00
    Non-members: $1440.00
Advanced Autonomous Control of DER Parallel Converters for Microgrid-Video
24 Sep 2024

Advanced Autonomous Control of DER Parallel Converters for Microgrid-Video

  • PELS
    Members: Free
    IEEE Members: $11.00
    Non-members: $15.00
MHz-Frequency High-Current Power MOSFET Technology for AI Data Centers-Video
19 Sep 2024

MHz-Frequency High-Current Power MOSFET Technology for AI Data Centers-Video

  • PELS
    Members: Free
    IEEE Members: $11.00
    Non-members: $15.00