Organic Package Substrates Using Lithographic Via Technology for RF to THz Applications

A. Aleksov, G. Dogiamis, T. Kamgaing, A. Elsherbini, J. Swan, K, Darmawikarta, S. Boyapati, J. Holloway, R. Han

DOI

10.17023/r9vn-bq18

EDS

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Length: 00:17:31

15 Dec 2020

Tags:

organic package

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