Organic Package Substrates Using Lithographic Via Technology for RF to THz Applications

A. Aleksov, G. Dogiamis, T. Kamgaing, A. Elsherbini, J. Swan, K, Darmawikarta, S. Boyapati, J. Holloway, R. Han

DOI

10.17023/r9vn-bq18

EDS

Members: $5.00
IEEE Members: $10.00
Non-members: $20.00

Length: 00:17:31

15 Dec 2020

Tags:

organic package

More Like This

Week 11 IAS Certificate Course: EMT simulation using PSCAD -Power System Fundamentals

19 Dec 2024

Week 11 IAS Certificate Course: EMT simulation using PSCAD -Power System Fundamentals

IAS

Members: $150.00
IEEE Members: $250.00
Non-members: $450.00

Synchro-Waveform Measurements and Data Analytics in Power Systems (TR 127)

18 Dec 2024

Synchro-Waveform Measurements and Data Analytics in Power Systems (TR 127)

PES

Members: Free
IEEE Members: $45.00
Non-members: $70.00

Week 10 IAS Certificate Course: EMT simulation using PSCAD -Power System Fundamentals

12 Dec 2024

Week 10 IAS Certificate Course: EMT simulation using PSCAD -Power System Fundamentals

IAS

Members: $150.00
IEEE Members: $250.00
Non-members: $450.00