Secure 3D CMOS Chip Stacks with Backside Buried Metal Power Delivery Networks for Distributed Decoupling Capacitance Kazuki Monta DOI 10.17023/ypyg-1y82 EDS Members: $5.00 IEEE Members: $10.00 Non-members: $20.00 Length: 00:19:46 15 Dec 2020 Tags: IEEE power delivery networks 3d cmos iedm backside buried distributed decoupling eds capacitance metal chip stacks kazuki monta secure video
15 Dec 2020 Tags: IEEE power delivery networks 3d cmos iedm backside buried distributed decoupling eds capacitance metal chip stacks kazuki monta secure video