Technology Sessions: Low Temperature SoIC^TM Bonding and Stacking Technology for 12/16-Hi High Bandwidth Memory (HBM)

C.H. Tsai

DOI

10.17023/j8pc-7w05

EDS

Members: $5.00
IEEE Members: $10.00
Non-members: $20.00

Length: 02:04:49

16 Jun 2020

Tags:

technology sessions

bonding and stacking

high bandwidth memory

low temperature