Thermal aware design of 3D Integrated Circuits using HotSpot 7.0 Mircea R. Stan, Junhan Han DOI 10.17023/17bq-k648 CAS Members: Free IEEE Members: Free Non-members: Free Length: 03:20:53 07 Aug 2022 Tags: IEEE cas video Thermal aware design 3d integrated circuits HotSpot 7 Mircea R Stan Junhan Han
07 Aug 2022 Tags: IEEE cas video Thermal aware design 3d integrated circuits HotSpot 7 Mircea R Stan Junhan Han