Advanced Packaging in Hyperscale Data Center Applications

Jie Xue, Vice President Technology & Quality, Cisco Systems, Inc. Advanced Packaging technologies including Silicon and Silicon photonics are key enablers for scaling the Hyperscale Data Center. This talk will discuss the roadmap of technology building blocks with a focus on increasing performance while reducing power per Gbps. Challenges for device integration, reliability and industry eco-system collaboration will also be discussed. Jie Xue leads Cisco’s Technology and Quality organization, a global team responsible for pathfinding, developing, and executing technology innovations to enable all Cisco networking product portolio. Jie oversees development of leading edge technologies for Si-Photonics, Advanced Si, ASICs, PCBs, Optics, memory, and complex interconnect technologies. Prior to joining Cisco, Jie held several management and engineering positions at Motorola, Inc., working on R&D and product development. Jie is an IEEE Fellow, and served as President of the IEEE’s Electronics Packaging Society (EPS) 2014-2015. She has published more than 90 technical papers and holds 15 patents. Jie holds a Bachelor of Science from Tsinghua University in Beijing, China and a Master of Science and PhD from Cornell University. For videos of previous Silicon Valley EPS Chapter talks, and to hear about future ones, please visit our website: www.ieee.org/scveps