Additive Manufacturing: Packaging Applications and Growth Needs for Heterogeneous Integration Impact
Kris Erikson
-
Members: FreeEPS
IEEE Members: Free
Non-members: FreeLength: 00:50:45
01 Feb 2024
Abstract: This talk profiles many of the current/future additive technologies, and covers major developments within additive manufacturing as applied towards electronics packaging needs generally and especially for heterogeneous integration applications, as well as overview the benefits and growth needs for these manufacturing approaches to have impact within our future electronic devices.
