Substrate Integrated Circuits (SICs)-A Paradigm for MHz to THz (MTT) Electronic and Photogenic Systems Slides

Widespread applications and commercial success of GHz and THz electronic and photonic devices and systems including RF, microwaves and millimeter-waves are closely related to their manufacturing cost and antenna-circuit integration. Our proposed integration technology of planar and non-planar structures as well as related new progress indicate that the emerging substrate integrated circuits (SICs) are able to provide unprecedented advantages for developing low-cost GHz/THz components, antennas, circuits and systems as well as wireless photonic applications. This talk reviews the state-of-the-art and underlying features of the proposed integration platforms for designing the next generation RF/millimeter-wave/THz ICs and systems. Challenging issues and future directions are discussed for R&D opportunities. Potential problems and possible solutions are also presented. It is believed that the technological platform of SICs will offer a cost-effective and performance-promising solution for mass commercial applications. With the development of innovative fabrication processes and material synthesis techniques, unique hybrid and monolithic high-density integration of planar and non-planar structures (or system-on-substrate approach) become realizable. It can also be demonstrated that this scheme of SICs may be able to effectively bridge the gap between electronics and photonics. In this presentation, global research activities and future RF/millimeter-wave developments will be discussed.