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  • MTT
    Members: Free
    IEEE Members: $9.00
    Non-members: $14.00
    Pages/Slides: 46
14 Feb 2017

Numerous inkjet-/3D-printed flexible antennas, RF electronics and sensors fabricated on paper and other polymer (e.g. LCP) substrates offer a system-level solution for ultra-low-cost mass production of Millimeter-Wave Modules for Communication, Energy Harvesting and Sensing applications. State-of-the-art area of 3D/inkjet-printed fully-integrated wireless sensor modules are explored on paper or flexible substrates and demonstrate the unique capabilities of additive manufacturing for the fully 3D integration of arbitrary-shape wireless sensors with RF systems on multiple substrate (glass, paper, plastic, etc). The first realizations of 4D (morphing/ shape changing/ origami) multilayer RF/microwave structures, that could potentially set the foundation for the truly convergent wireless sensor ad-hoc networks of the future with enhanced cognitive intelligence and "rugged" packaging.

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