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Additively Manufactured Flexible Autonomous Reconfigurable Intelligent Surfaces, (RIS), "Smart" Packaging Structures and Backscattering Communication Modules up to 5G/mmW Frequencies
12 Dec 2023

Additively Manufactured Flexible Autonomous Reconfigurable Intelligent Surfaces, (RIS), "Smart" Packaging Structures and Backscattering Communication Modules up to 5G/mmW Frequencies

  • MTT
    Members: Free
    IEEE Members: $9.00
    Non-members: $14.00
Silicon Technology Roadmap to Address Wireless Communication from Sub 6GHz to Sub THz Frequencies
25 Jan 2023

Silicon Technology Roadmap to Address Wireless Communication from Sub 6GHz to Sub THz Frequencies

  • EDS
    Members: Free
    IEEE Members: $15.00
    Non-members: $20.00
Best Practices in Installation and Test of Board Level Passive Components for Applications at Frequencies of Ka-Band and Above
14 Jul 2020

Best Practices in Installation and Test of Board Level Passive Components for Applications at Frequencies of Ka-Band and Above

  • MTT
    Members: Free
    IEEE Members: Free
    Non-members: Free