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3d integration

Towards New Architectures for 3D Integration
04 Mar 2022

Towards New Architectures for 3D Integration

  • CAS
    Members: Free
    IEEE Members: Free
    Non-members: Free
Towards New Architectures for 3D Integration
04 Mar 2022

Towards New Architectures for 3D Integration

  • CAS
    Members: Free
    IEEE Members: Free
    Non-members: Free
3D Integration of Vertical Stacking of MoS2 and Si CMOS Featuring Embedded 2T1R Configuration Demonstrated on Full Wafers
15 Dec 2020

3D Integration of Vertical Stacking of MoS2 and Si CMOS Featuring Embedded 2T1R Configuration Demonstrated on Full Wafers

  • EDS
    Members: $5.00
    IEEE Members: $10.00
    Non-members: $20.00
A Stacked Embedded DRAM Array for LPDDR4/4V using Hybrid Bonding 3D Integration with 34GB/s/1Gb 0.88pJ/b Logic to Memory Interface
15 Dec 2020

A Stacked Embedded DRAM Array for LPDDR4/4V using Hybrid Bonding 3D Integration with 34GB/s/1Gb 0.88pJ/b Logic to Memory Interface

  • EDS
    Members: $5.00
    IEEE Members: $10.00
    Non-members: $20.00
Benchmarking Monolithic 3D Integration for Compute in Memory Accelerators: Overcoming ADC Bottlenecks and Maintaining Scalability to 7nm or Beyond
15 Dec 2020

Benchmarking Monolithic 3D Integration for Compute in Memory Accelerators: Overcoming ADC Bottlenecks and Maintaining Scalability to 7nm or Beyond

  • EDS
    Members: $5.00
    IEEE Members: $10.00
    Non-members: $20.00
How 3D Integration Technologies Enable Advanced Compute Node for Exascale Level High Performance Computing?
15 Dec 2020

How 3D Integration Technologies Enable Advanced Compute Node for Exascale Level High Performance Computing?

  • EDS
    Members: $5.00
    IEEE Members: $10.00
    Non-members: $20.00
Monolithic 3D Integration of High Endurance Multi-Bit Ferroelectric FET for Accelerating COmpute In Memory
15 Dec 2020

Monolithic 3D Integration of High Endurance Multi-Bit Ferroelectric FET for Accelerating COmpute In Memory

  • EDS
    Members: $5.00
    IEEE Members: $10.00
    Non-members: $20.00
Silicon Compatible Optical Interconnect and Monolithic 3D Integration
15 Dec 2020

Silicon Compatible Optical Interconnect and Monolithic 3D Integration

  • EDS
    Members: $5.00
    IEEE Members: $10.00
    Non-members: $20.00
Low Temperature Smart Cut Enabling 3D Integration
01 Mar 2020

Low Temperature Smart Cut Enabling 3D Integration

  • EDS
    Members: $5.00
    IEEE Members: $10.00
    Non-members: $20.00
Millimeter Wave and 5G Multilayer 3D Integration and Packaging: Advanced Technologies and Techniques Slides
01 Jun 2018

Millimeter Wave and 5G Multilayer 3D Integration and Packaging: Advanced Technologies and Techniques Slides

  • MTT
    Members: Free
    IEEE Members: $9.00
    Non-members: $14.00
Millimeter Wave and 5G Multilayer 3D Integration and Packaging: Advanced Technologies and Techniques Video
01 Jun 2018

Millimeter Wave and 5G Multilayer 3D Integration and Packaging: Advanced Technologies and Techniques Video

  • MTT
    Members: Free
    IEEE Members: $9.00
    Non-members: $14.00
3D Integration Slides
09 Feb 2014

3D Integration Slides

  • SSCS
    Members: Free
    IEEE Members: $10.00
    Non-members: $20.00
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