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eric beyne

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A 3D Heterogenous Integration Future: Enabling Continued Scaling of Electronics Systems
11 Jul 2022

A 3D Heterogenous Integration Future: Enabling Continued Scaling of Electronics Systems

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: Free
    Non-members: Free
System Exploration and Technology Demonstration of 3D Wafer to Wafer Integrated STT-MRAM Based Caches for Advanced Mobile SoCs
15 Dec 2020

System Exploration and Technology Demonstration of 3D Wafer to Wafer Integrated STT-MRAM Based Caches for Advanced Mobile SoCs

  • EDS
    Members: $5.00
    IEEE Members: $10.00
    Non-members: $20.00
ECTC 2020 Outstanding Session Paper
01 Jun 2020

ECTC 2020 Outstanding Session Paper

  • EPS
    Members: Free
    IEEE Members: $11.00
    Non-members: $15.00