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A High Density Logic on Logic 3DIC Design Using Face to Face Hybrid Wafer Bonding on 12nm FinFET Process
15 Dec 2020

A High Density Logic on Logic 3DIC Design Using Face to Face Hybrid Wafer Bonding on 12nm FinFET Process

  • EDS
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mmWave and sub-THz Technology Development in Intel 22 nm FinFET (22FFL) Process
15 Dec 2020

mmWave and sub-THz Technology Development in Intel 22 nm FinFET (22FFL) Process

  • EDS
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Performance and Reliability Improvement in Ge nMOSFETs with Different Surface Orientations Through Channel Flattening Process
01 Mar 2020

Performance and Reliability Improvement in Ge nMOSFETs with Different Surface Orientations Through Channel Flattening Process

  • EDS
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    Non-members: $20.00
Halt and Hass: Equipment, Fixtures, Process, Implementation
15 Dec 2000

Halt and Hass: Equipment, Fixtures, Process, Implementation

  • RS
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    IEEE Members: $11.00
    Non-members: $15.00