A High Density Logic on Logic 3DIC Design Using Face to Face Hybrid Wafer Bonding on 12nm FinFET Process
Saurabh Sinha, Shawn Hung, Daniel Fisher, Xiaoqing Xu, Chien Ju Chao, Pranavi Chandupatla, Frank Frederick, Heath Perry, Daniel Smith, Alberto Prasad, Robert Katz, Albert Kinsbruner, John Garant, Jorge Lubguban, Sarah Knickerbocker, Vilmarie Soler, Brian Cline, Robert Christy, Teresa McLaurin, Norman Robson, Daniel Berger
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15 Dec 2020
