Skip to main content

robert katz

Showing 1 - 1 of 1 resources. Too many results? Use the search filters to refine your search.
Sort by
A High Density Logic on Logic 3DIC Design Using Face to Face Hybrid Wafer Bonding on 12nm FinFET Process
15 Dec 2020

A High Density Logic on Logic 3DIC Design Using Face to Face Hybrid Wafer Bonding on 12nm FinFET Process

  • EDS
    Members: $5.00
    IEEE Members: $10.00
    Non-members: $20.00