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Organic Package Substrates Using Lithographic Via Technology for RF to THz Applications
15 Dec 2020

Organic Package Substrates Using Lithographic Via Technology for RF to THz Applications

  • EDS
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HfO2 Based FeFET and FTJ for Ferroelectric Memory Centric 3D LSI Towards Low Power and High Density Storage and AI Applications
15 Dec 2020

HfO2 Based FeFET and FTJ for Ferroelectric Memory Centric 3D LSI Towards Low Power and High Density Storage and AI Applications

  • EDS
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Monolithic 3D+IC Based Massively Parallel Compute in Memory Macro for Accelerating Database and Machine Learning Primitives
15 Dec 2020

Monolithic 3D+IC Based Massively Parallel Compute in Memory Macro for Accelerating Database and Machine Learning Primitives

  • EDS
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Progressing -190 C to +500 C Durable SiC JFET ICs From MSI to LSI
15 Dec 2020

Progressing -190 C to +500 C Durable SiC JFET ICs From MSI to LSI

  • EDS
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Advances in Research on 300 mm Gallium Nitride on Si (111) NMOS Transistor and Silicon CMOS Integration
15 Dec 2020

Advances in Research on 300 mm Gallium Nitride on Si (111) NMOS Transistor and Silicon CMOS Integration

  • EDS
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Opportunities and Limitations of Emerging Analog in Memory Computer DNN Architectures
15 Dec 2020

Opportunities and Limitations of Emerging Analog in Memory Computer DNN Architectures

  • EDS
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Fundamental Challenges in Augmented Reality Display Technology
15 Dec 2020

Fundamental Challenges in Augmented Reality Display Technology

  • EDS
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Secure 3D CMOS Chip Stacks with Backside Buried Metal Power Delivery Networks for Distributed Decoupling Capacitance
15 Dec 2020

Secure 3D CMOS Chip Stacks with Backside Buried Metal Power Delivery Networks for Distributed Decoupling Capacitance

  • EDS
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A Novel Complementary Architecture of One Time Programmable Memory and Its Applications as Physical Unclonable Function (PUF) and One Time Password
15 Dec 2020

A Novel Complementary Architecture of One Time Programmable Memory and Its Applications as Physical Unclonable Function (PUF) and One Time Password

  • EDS
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From Interconnect Materials and Processes to Chip Level Performance: Modeling and Design for Conventional and Exploratory Concepts
15 Dec 2020

From Interconnect Materials and Processes to Chip Level Performance: Modeling and Design for Conventional and Exploratory Concepts

  • EDS
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Silicon Compatible Optical Interconnect and Monolithic 3D Integration
15 Dec 2020

Silicon Compatible Optical Interconnect and Monolithic 3D Integration

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Reliability and Performance of CMOS Compatible Multi-Level Graphene Interconnects Incorporating Vias
15 Dec 2020

Reliability and Performance of CMOS Compatible Multi-Level Graphene Interconnects Incorporating Vias

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